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Solder Profile

The soldering profile depends on various parameters necessitating a set up for each application. The data here is given only for guidance on solder re-flow. There are four zones:
1. Preheat Zone - This zone raises the temperature at a controlled rate, typically 1-2.5°C/s.
2. Equilibrium Zone - This zone brings the board to a uniform temperature and also activates the flux.
The duration in this zone (typically 2 -3 minutes) will need to be adjusted to optimize the out gassing of the flux.
3. Reflow Zone - The peak temperature should be high enough to achieve good wetting but not so high as to cause component discoloration or damage. Excessive soldering time can lead to inter-metallic growth which can result in a brittle joint.
4. Cooling Zone - The cooling rate should be fast, to keep the solder grains small which will give a longer lasting joint. Typical rates will be 2-5°C/s.

General Description

The BT 44 – 1 9 1  module provides a completely pre-engineered ready to use Bluetooth solution for embedded systems. The module implements the Bluetooth stack through the HCI layer enabling it to interface. The module was designed from the ground up for embedded systems to provide unmatched compatibility, ease of integration, and total cost of ownership.

Applications

The BT 44 – 1 9 1 is ideal for enabling cost sensitive designs with a widely supported industry standard wireless protocol. Monitoring and control applications will benefit from an integrated implementation of the serial port profile for seamless connectivity with desktop computers, PDAs, and cellular phones. A focus on low current consumption makes the BT44-191S ideal for use in standalone battery powered devices common to medical and remote data capture applications.
 

Development Kit for New Users

Jumpstart your evaluation and design efforts with a complete development kit which includes One Evaluation Board, One USB Bluetooth adapters, documentation on CD-ROM, and a full reference design.